The Application Of Surface Nanocone Array Technology In Lead-free Pd PPF Lead Frame

The push from semiconductor industry for lead-free products is stronger than ever, more and more effort is being put globally to find feasible alternative solutions to replace the traditional lead-based packages. For lead finish, Ni/Pd/Au pre-plated frame (Pd PPF) is an attractive alternative as a replacement for the tin-lead plating.The Pd PPF not only ensure the bonding strength between the inner ends and Au wires but also accomplish the solderability of the outer ends to leave out plating process after packaging, thus the use of lead can be avoided. Yet the weak chemical binding between the Au and the epoxy may easily lead to the delamination between the Pd PPF and epoxy, so that the quality of the whole product may be influenced, and Pd PPF can not meet the high reliability requirement for electronic products in the automobile aviation industries. Finding out a simple and feasible method to improve the adhesion strength become an urgent subject.This dissertation adopted Nanocone Array (NCA) technology on the...