| An epoxy resin composition with low electronic impedance was prepared using copolymerization and curing of bis-phenol A type epoxy resin (E-44, E-51), calcium ion complex intermediate, and ethylene diamine(EDA) and diethylene triamine (DETA). The bulk electronic resistance and mechanical properties of the composition were measured. The curing process and the thermal stability of the composition were analyzed by DSC and TG. The effects of the ratio of calcium ion complex intermediate to the epoxy resin and reaction time on the bulk electronic resistance of the low electronic impedance epoxy resin composition were investigated. The results showed that the epoxy resin could possess the property of low electronic impedance by using the metal ion complex intermediate, and that the effect of the intermediate on mechanical properties of the epoxy resin composition was not significant.Active thinner rather than solvent was added to the epoxy resin composition with low electronic impedance to decrease the viscosity, then some pigment and filler were added to the diluted epoxy resin, at last curing agent was added to prepare solvent-free epoxy floor paint with low electronic impedance. The effects of solid content in the epoxy floor paint and the mass ratio of talc to mica in the filler on the bulk electronic resistance, impactive intensity and flexural resilience were investigated, and the best formula was found out, when the solid content was 85 and the mass ratio of talc to mica was 3:1, the bulk electronic resistance got theminimum(1.503×10~7Ω·cm). The mechanical properties of the epoxy floor-painting were measured according to corresponding GB/T, the result indicated that the solvent-free epoxy floor paint with low electronic impedance was completely qualified for industrial application.
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