The Finite Element Analysis Simulation Of The Thermal Stresses In Tungsten Carbide Grinding

Because the tungsten carbide has the characteristic of high hardness, high brittleness and lower coefficient of thermal conductivity, it usually use diamond grinding wheel to grind it. During the grinding process, abrasive grain of grinding wheel is very easy to blunt, and acute friction along the contact face will cause transient local high temperature and additional thermal stress on the surface of tungsten carbide. This stress will bring on heat deformation and heat flaw, and reduce cutter life and product quality. In this paper, the finite numerical simulation method is used to analyze the grinding temperature field, the thermal stress of it. This study provides powerful support for grinding mechanism analysis and grinding quality improvement in following research.Firstly, this paper introduced the Finite Element theory and the way to solve the thermal stress, established the mathematic model of tungsten carbide grinding process.Secondly, the temperature field distribution at different moment with different condition is studied in detail with ABAQUS (A Finite Element Analysis software). At the same time, the model was validated by the temperature measurement result in the experiment of tungsten carbide grinding.At last, the thermal stress distribution during grinding process was farther researched base on the former analysis of grinding temperature.