Preparation Of Copper Alloy By Infiltration Method

Copper and copper-base alloys are used widely because they have the advantages of high electrical and thermal conductivities, good mechanical properties, outstanding corrosion and fatigue resistance. However, comprehensive properties are more and more required for copper alloys with the rapid development of the electronic industry.The rule and mechanism of reaction diffusion has been studied in this paper by infiltrated copper powder compact with liquid aluminum, tin and zinc. Different between the results of the methods of copper powder compact wrapped by aluminum sheet and embed in aluminum powder has been told. The velocity of infiltration under vacuum, air and argon atmosphere has been compared. The experiments of preparing copper-tin and copper-zinc alloy by infiltrating has been processed at different temperature for 6 hours to make sure the appropriate temperature. Then infiltrated at the optimal temperature for different period. The rule between the depth of infiltration and the phase composition and temperature and period of infiltration has been concluded. And the rule between phase composition and temperature and period of infiltration also has been concluded. The results show that :First, the decreasing sequence of infiltration velocity of the wrapped method in different atmosphere is vacuum, air and argon atmosphere. The copper-aluminum alloy prepared by wrapped method in vacuum and air atmosphere is more close to the copper in the phase diagrams with the pressure of the copper powder compact increase. In argon atmosphere, the thickness of the infiltration of both the wrapped and embed method is increased with the pressure of the copper powder compact decrease. When we use the embedded method, the depth of infiltration is fluctuate acutely under air and vacuum, but the depth of infiltration is even under argon atmosphere.Secondly, the temperature and period of infiltration effect the composition of IMC, the thickness of IMC increases with the temperature rise and the period prolonged. The interface of copper-zinc IMC is flat, the form copper-sin IMC is column which grows towards sin. The copper granule and copper-sin IMC have been found in the sin.The third, the velocity of infiltration increases with the temperature rises, when temperature rises to a particular value the velocity of infiltration will be enhanced consumedly, the particular temperature of infiltrating sin is between 400℃and 500℃, and infiltrating zinc is between 600℃and 700℃...