Analyze The Simulation Principle Of Carbon Fiber Skin And Plate Working Togetherin Process Of Bonding

The questions of a variety of composite component bonding distortion have become more and more prominent, with the applications of the composite in the aerospace engineering. Because of high centralized instantaneous heat input, a great deal of residual stress and deformation should be brought in the process of the bonding, which can heavily influence the capability of bonding structure. Therefore it is essential to calculate and analyze the shrinking principle of residual stress at elastic-plastic mechanical theory in bonding process. Based on others experience, with numerical calculation, this paper researches how to realize the dynamic simulation of bonding of the carbon fiber skin and plate, adhesive is epoxy resin, then uses the research results to simulate the bonding process of the bonding process of the T-section bonding plane. The same time the temperature field and stress field of bond have been investigated so that we can realize the course of bonding distortion.Firstly, the bonding basic principle and the common course of bonding technology are briefly recounted. The author analyzes the bonding characteristic of finite element analysis, simply introduces the category of residual stress and experimental method of testing residual stress because of composite bonding. The paper describes the basic theories and numerical analysis methods of the temperature field and residual stress field. In the process of numerical simulated calculating, with the thermal–structure coupling function of ANSYS software and indirect coupling. On this condition nonlinear transient conductive equation has been extracted, bonding elastic-plastic constitutive relationship has been deduced.Secondly the author introduces the nonlinear finite element analysis software ANSYS base on temperature effect, explains material nonlinear and the simulation of temperature field. Based on accurate temperature field results, bonding residual stress are also calculated by changing thermal elements into structural elements. At last the paper analyzes a simple thermal-structure example.Finally the bonding course of the carbon fiber skin and plate has been simulated. By"Birth and Death"method, elements whose temperature are in excess of material melting points are activated. Dynamic simulation on epoxy resin melting and freezing is fulfilled, longitudinal bonding residual stresses and tendency of their distribution is presented. The dynamic simulation method provides the theoretic analysis of residual stress and instruction, promotes the application of finite element method on bonding mechanics and engineering.