Fabrication Of Ni-P-B Foil And The Research On Its Nanocrystallization

In this paper, electroless technology had been used to coat Cu, Ni-P-B on the surface of plastic matrix, and then matrix plastics had been dissolved in solvent to get Ni-P-B foil. Firstly analysed the influence of the factors as CuSO₄ , C₄H₄O₆KNa·4H₂O, NaOH, HCHO on Cu deposition ratio, and used SEM to get the properties of Cu foil and the mechanism and activation energy of chemical plating Cu.Experiment results show that Cu deposition rate appears a trend that firstly increased followed by the increase of the content of CuSO4, C₄H₄O₆KNa·4H₂O, NaOH, HCHO, when reach a maximum and then declines. Deposition rate increased with coating temperature. Chemical plating Cu reaction to Cu²⁺, HCHO, OH- is first order reaction, and the total reaction order is 3. The reaction rate constant is 0.0521mol^-2·dm⁹·min^-1·cm^-2, and the activation energy is 57.3kJmol^-1.The surface of Cu coating was slippery and compact, had no small holes, and jointed with matrix plastics well.Experiment results show that the electroless and amorphous crystallization technology had been used to synthesize the Ni-P-B foil whose average grain size is about 39-47 nm.Ni-P-B deposition rate appears a trend that firstly increased followed by the increase of the content of NiCl₂, KBH₄, NH₂(CH₂)₂NH₂, NaH₂PO₂, H₂NCSNH₂, Pb(NO₃)₂ , when reach a maximum and then declines. Deposition rate increased with coating temperature.Two distinct heat release peaks appeared at 351℃and 482℃in the Ni-P-B alloy containing 2.002wt%B, 6.591wt%P, respectively started up at 250℃and 471℃, and ended at 351℃and 494℃.