Study Of Polishing Technology For Single Crystal Wafer

As IC's technique advances, integrated circuit chips are developing toward higher density, higher performance and higher integration. The quality requirement of the single-crystal silicon processing is high more and more. This paper introduced the structure. Prepare. processing parameters and processing technics of single crystal silicon, current development. traditional polishing and the latest development in ultra precision-polishing technology for several typical ultra precision-maching crystal materials internal.It summarized especially the characteristics of machining equipments and techniques developed for machining crystal wafers such as single crystal silicon, and explored their developing tendency. It is an important impact factor of polished silicon wafer processing quality is process parameters and composition,particle size,concentration of solution PH value, and so on. Appropriate technical parameters and the polishing liquid on the surface of the wafer can be obtained a certain thickness and diameter of a high yield of semiconductor silicon polishing wafer.