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Research Of SiC_p/Cu Composite Prepared By Powder Metallurgy And Its Properties

Posted on:2010-02-10Degree:MasterType:Thesis
Country:ChinaCandidate:D ChenFull Text:PDF
GTID:2121360278481282Subject:Materials science
Abstract/Summary:PDF Full Text Request
SiCp/Cu composite is a new structural-functional integration material, which has a promising potential in future capplication due to their good combination of electric conduetivity(EC), mechanical property and tailorable CTE.The 50μmβ-SiC powder was used in present work,and coated with Cu by electroless copper plating process,then the composition and morphology of SiCp/Cu composite powders were also analyzed by SEM and EDS methods. SiCp/Cu composites were fabricated by vacuum at 900℃for the coated powder,the volume of SiC in the composites was of 30vol%,40vol% and 50vol% respectively. The microstructure and interface structure of the SiCp/Cu composites were observed by metallographic microscope and SEM methods, and the phase structure of the SiCp/Cu composites were observed by XRD method. The Rockwell hardness, frictional wear property, electric conductivity(EC) and coefficient of thermal expansion(CTE) of the composites were measured, and the effect of the volume of SiC on the Rockwell hardness, frictional wear property, EC and CTE of SiCp/Cu composites were also discussed. The main results are:Electroless copper planting under 50℃, pH=12.5, CuSO4·5H2O 30g/L,EDTA·2Na 1g/L,K4[Fe(CN)3]·3H2O 2g/L,NaOH 34 g/L,HCHO 24 ml/L and C4H4O6KNa·4H2O 105 g/L, the Cu coating on the surface of SiC particles is uniformity and densification, the interface between SiC particles and Cu matrix is bonded well. The coating quality of C4H4O6KNa·4H2O and EDTA·2Na is better than C4H4O6KNa·4H2O.The melting point of Cu crystallite on the surface of SiC is lower than pure Cu, so the sintering character between SiC particles and Cu improved, and Cu coating and Cu powders speedy opacification, the densifieation of SiCp/Cu composite is 96%. The composites were free of porosity and the SiC particles distribute uniformly in the composites; and the phase composition of SiCp/Cu are Cu and SiC, no other reaction product.The Rockwell hardness and wear-resisting property of the composites mainly controlled by the volume of SiC when the volume of SiC is less than 40%; the Rockwell hardness and wear-resisting property of the composites mainly controlled by porosity when the volume of SiC is more than 40%. The Rockwell hardness is 25.2HRC when the volume of SiC is 40%.The wear-resisting property of SiCp/Cu composite increased with the increasing of SiC content. The abrasion mechanism of SiCp/Cu composites is coactions of grain-abrasion and adhesion-abrasion, the abrasion mechanism of SiCp/Cu composites is adhesion-abrasion of Cu when the volume of SiC is 30%, with the increasing of SiC content, the grain-abrasion is more patency.With the increasing of SiC content, the CTE of SiCp/Cu composites decreased, but the ambient temperature resistivity increased.
Keywords/Search Tags:electroless copper plating, powder metallurgy, SiC_p/Cu composites, friction and wear behavior
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