Molecular Dynamics Modeling And Simulation For Nanometric Cutting Of Monocrystalline Copper

With the development of modern science and technology, there is an increasing demand for precision machining and surface quality in the fields of micro-electronics, aerospace, semiconductor, etc. At present, the demand of machining precision has reached nanometers magnitude. Therefore, it is important to get an understanding of cutting process in nano-meter scale.The molecular dynamics (MD) which researches the fundamental particle characteristic not only contacts the macro features and micro structures, but gives unique explanations to some special phenomena that are hardly macro theory and experiment. In this paper, MD model is explored to study nanometric cutting process.Firstly, the development and current situation of molecular dynamics simulation are more comprehensive overviewed, basic principles and algorithms are studied. On this basis, the MD model of nanometric cutting is explored. Secondly, LAMMPS is used to simulate nanometric cutting process.Snapshots at different steps are achieved by VMD, the cutting process is observed. From the point of crystal lattice deformation, materials removing and processing of machined surface were discussed.Based on the MD model, the effect of cutting parameters (cutting speed, cutting depth and geometry of tool) on cutting process are studied by analyzing the snapshots and variations of potential energy and cutting force in the cutting process.Lastly, the two-body Morse potential and the many-body EAM potential were used for the atoms interaction in the copper workpiece to study the effect of different potentials on the simulation results.