| With the rapid development of electronic industry, it becomes more and more desired for the performance of printed circuit board (PCB). Therefore, the properties of copper clad laminate (CCL) that is used as an essential substrate of PCB also are required higher and higher, inconcluding thermal, dielectric, mechanical properties and so on. Because of this, main research is conducted as follows. Firstly, the properties of copper clad laminates (CCLs) which were prepared by epoxied polyhedral oligomeric silsesquioxane (EOVS) modifying cyanate-epoxy ester were studied. It is hoped to provide guidance for the development of PCB used in high-frequency. Secondly, to develop high-performance resins used as matrix of CCLs, epoxy nanocomposites containing octaaminophenyl polyhedral oligomeric silsesquioxane (OAPS) were prepared, the properties of which were studied.In the first part, EOVS was synthesized and characterized. The cyanate -epoxy hybrid resin modified by EOVS as matrix, a series of CCLs with different raitio were prepared. Thermal properties, mechanical properties, dielectric properties and water absorption of CCLs have been studied. The test results showed that incorprating of 1wt% EOVS to cyanate-epoxy systems not only greatly prolonged the gel time of impregnants, but also significantly enhanced the glass transition temperature (Tg) and flexural strength of CCLs, meanwhile, effectively decreased the water absorption and dielectric constant of CCLs. Thermal, mechanical, dielectric properties and moisture absorption performance of CCLs were improved with the increase of cyanate content. The CCL containg 40wt% cyanate,60wt% epoxy resin and 1wt% EOVS was with high Tg (187℃), flexural strength (620MPa), excellent dielectric and moisture absorption properties. The comprehensive properties of that were best among all of the CCLs.In the second part, the epoxy nanocomposites containing OAPS were prepared via the co-curing reaction between OAPS and brominated epoxy resin (EP). The gel time, dispersion, thermal properties, mechanical properties, water absorption and dielectric properties of the OAPS/EP composites were studied. The test results showed that the appropriate amount of OAPS were dispersed in epoxy matrix at the molecular level since the POSS monomer participated in the cross-linking reaction, which made the thermal properties, mechanical properties, water absorption and made the thermal properties, mechanical properties, water absorption and dielectric property of composites improved in comparison of control epoxy. The Tg of composites containing 1wt% and 2wt% of OAPS increased by 10℃and 20℃, respectively. The dielectric constant value of the composite containing 1wt% OAPS reduced by 0.5 in comparison with the control epoxy resin in the range of 100～4×107Hz.
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