Study On Heat-resistance Of Copper Clad Laminate Based Adhesive

In this paper, by analyzing the pyrolysis chromatography of paper-based laminate adhesive, and focusing on the temperature of the resistance to soldering testing and CTI value testing, we study the decomposition of it. And we also study the acetal structure and its influence of thermal stability of polyvinyl acetal which was used as toughening agent and tackifier. Through testing the thermal stability of silica and adhesives, we study how the amount of silica and the cure of adhesives affect the soldering time.Through the analysing of the thermal decomposition process of adhesives, we found that plastic foil contains a good deal of PVEB which was used as toughening agent and tackifier. However, PVEB is the polymer whose heat resistance is bad. It is because that it will be decomposition easily and generate butanol molecules. And the condition adverse to the enhance of soldering iron. Through the studing of the TGA weight loss process of two kinds of PVEB with different acetal structure, and futher on studing of the activation energy of its weight loss process by thermal decomposition, we found that when the main-chain structure, molecular weight and molecular weight are general the same, the heat resistance of PVEB with high reduction of acetaldehyde-based content. In the thermal decomposition process of PVEB, the decomposition of side groups happens first, then the main strand breaks, and the decomposition temperature of reduced acetaldehyde-based and main chain are the same. Also, by thermal decomposition kinetics of treatment of Flynn-Wall-Ozawa and Kissinger, we found that the data of apparent activation energy of thermal decomposition ally the same: it is obviously that, the thermal decomposition activation energy of butyral side groups lower than the thermal decomposition activation energy of reduced acetaldehyde-based.The adding of silica elvated the decomposition temperature of original formula, its function is not only limit to filling and also for absorbing heat, remission the decomposition of Adhesives, forming the protective layer. We found that the residual rate gained more improvements of the adding amount of silica. It illustrates that the physical crosslinking forms by adding the silica, and the heat resistance is enhanced to some extent.Putting in the silica is in favor of the improvments of soldering time of adhesives. It is because of that by dealing with the surface of silica, the nanoparticles act as the crosslinked in the matrix, and its surface avails of the tangles of resin chains. And putting in the silica makes the CTI value of adhesives decreased. By and large, with the increasing of the amount of Silica, the CTI value decreases obviously. And the different diameter of particles and curing temperature affect the soldering time and CTI value.