| With excellent high quality of high thermal conductivity, low expansion, high module, high chemical stability and low density,β-SiCP/Al composite enjoys great potential of application in the realm of electronic packaging.Powder Metallurgy Method has the following advantages:mixing uniformity,component easily controlled,forming more easily,geting high density composite materials,etc.it is a commonly used methods to manufacture Metal Matrix Composites,especially particle reinforced metal matrix composites.So we adopt Powder Metallurgy Method to manufactureβ-SiC/Al Electronic packaging materials with volume fraction to 50%.Testing the tap density , bulk densityand porosity ofβ-SiC powder, the average size D = 17.94μm ofβ-SiC particles is good at reinforcement phase. Surface treatment methods for the sic micro powder include the following three steps:the high temperature oxidation 1,100 degrees,HF acid pickling,200degrees drying,these methods eliminated adsorption of gases and moisture,made edges passivation and improved the dispersion of SiC micropowder,manufacturedβ- SiC/Al electronic packaging materials with enhance body distributed evenly,high density,pore less.In the process,the specific preparation processes of forming pressure,sintering temperature,hot-pressure have an effects on the material morphology ,relative density. Determining the forming pressure 320MPa,the sintering temperature1000℃,hot- pressure 3MPa as the optimal parameters in the preparation of 50%β-SiCp/Al .To sum up, The 50%β-SiCp/Al composites fabricated by powder-metallurgy with 17.94μm spherical SiC particles enjoy perfect comprehensive thermal and physical properties.: its its coefficient of thermal expansion is 8.86×10-6·K-1 under20℃～150℃; the thermal conductivity is 124W·m-1·K-1 .Owing to the high temperature applied, the network composites produced are sound. The results indicate that the composites sintered in liquid phase always satisfy the electronic packaging application.
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