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Research On Diallyl Bisphenol A Modified Bismaleimide High-temperature Adhesive

Posted on:2011-12-15Degree:MasterType:Thesis
Country:ChinaCandidate:T LuoFull Text:PDF
GTID:2131330332479458Subject:Applied Chemistry
Abstract/Summary:PDF Full Text Request
Bimaleimide (BMI) was invented and industrialized by Laura-Plank company in the late 60s of the 20th century. The BMI has been the fastest developed resin for composite materials for its excellent properties like fine thermal stability, inoxidizability, high electric insulation and dimensional stability, and electric stability over wide range of temperature, which are attributed to the short distance of double bond and high cross-linking density. The development of the composite resin matrix was quickly overseas in the recent 30 years. However, the homopolymer of BMI is brittle and the compatibility with other material is poor which jeopardized the properties of the composite materials. Therefore, certain modification should be made to enhance its comprehensive properties and manufacturability. Due to the high activity of the double bond in the BMI, it can be modified with various chemicals containing active hydrogen atoms or unsaturated bonds, like allyl, epoxy resin, amide, etc.In this thesis, the bismaleimide resin was chosen as matrix, and the ortho-diallyl bisphenol A modified bismaleimide composite resin matrix was synthesized and modified with physicochemical method and characterized with modern analytical techniques on the aspects of compositions, structures, thermal stability and mechanical properties of the composite materials.(1) To the synthesis of bismaleimide (BMI)/ortho-diallyl bisphenol A (DABPA) cured polymer, the best reaction mass ratio of the modified matrix is decided to be BMI: DABPA=4:1 according to the mechanical performance tests. The curing reaction was characterized with FTIR, DSC and DMA. The thermodynamic and dynamic mechanical property were also studied via DSC,TG and DMA.(2) To the preparation of bismaleimide (BMI)/ortho-diallyl bisphenol A (DABPA) /bisphenol A type epoxy resin (E-51) ASP system, the best composition of the system was determined to be BMI:DABPA:E-51=4:1:1 (mass ratio) by mechanical performance tests.The FTIR,DSC and DMA testing was applied to the BMI/DABPA/ BPAE-51 curing reaction. The thermodynamic and dynamic mechanical property were also studied via DSC,TG and DMA. (3) To the preparation of BMI/DABPA/rubber modified BPA(E-51) polymer composit, the optimized composition of BMI:DABPA:E-51 determined to be 4:1:1(mass ratio) with mechanical performance tests. The FTIR, DSC and DMA testing was applied to the BMI/DABPA/rubber modified BPAE-51 curing reaction. The thermodynamic and dynamic mechanical property were also studied via DSC, TG and DMA.According to the research result of section (2) and (3), it was concluded that the thermal and mechanical properties of the adhesives made of BMI/DABPA/rubber modified E-51 were enchanced compared with those made of BMI/DABPA/E-51. When the mass ratio of BMI:DABPA:E-51 equaled to 4:1:1, the Tg and Td of the glue increased to 223.639℃和330℃, sticky strength to 6.7 MPa.
Keywords/Search Tags:Ortho-diallyl bisphenol A, Epoxy resins, Bismaleimide, Heat-resistance adhesive
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