Study On Synthesis And Properties Of Room Temperature Curing Conductive Adhesive

First, the definition, sort, material composite and mechanisms of conductive adhesive were discussed in the summarization. Then introduced the emerge of conductive adhesive is because the great toxicity of tin-lead solder both to the environment and body healthy in the microelectronics packaging industry. After the comparison, point out the trend of conductive adhesive.In this paper, conductive adhesive was synthesized by using biphenol A epoxy resin E-51 as the polymer matrix, silver-plated copper as the conducting material,593 and DMP-30 as curing agent. Added silane coupling agent, acetone as solvent, and CTBN, sepiolite flocking, znic oxide whisker as toughening agent and reinforcing agent. Volume resistivity, tensile shear strength, TGA, hygrothermal aging had been tested. Then, the optimum filling amount of the adddtive agents in the conductive adhesive system was attained.It showed that the mass of CTBN, sepiolite flocking, znic oxide whisker were 10%,1% and 3% of the mass of E-51 respectively.After had gotten the good room temperature curing conductive adhesive, proper heat curing were test for example 50℃and three hours curing,70℃and two hours curing, it showed that 50℃curing is the best during the three technologies. At last, we discussed the curing process by the IR spectroscopy and got the reason is room temperature curing is comparatively low so the cross-linked structure was not enough perfect, meanwhile the 70℃curing is so high that inside of the conductive adhesive result in explosive polymerization.