Study On Processing Parameters And Tensile Properties Of Electrodeposited Copper Foil

The copper foil with thickness of 30μm was prepared by electrodeposition. We analyzed the effects of the process parameters on the deposition rate, surface morphology and tensile strength by a digital camera, SEM and the tensile properties.The results indicated that the pH value and the distance between two electrodes have little effect on the deposition rate. The electrolytic copper foil with a smooth surface, small tissue and a large tensile strength(close to 100 MPa) could be obtained at 65℃with pH value of 2³ and distance between two electrodes of 20³0 mm.The deposition rates increased with the increasing of current density in different electrodeposition methods. With the same current density, the deposition rate of DC static electrodeposition was lower than the deposition rate of DC stirring electrodeposition, and the deposition rate of static pulse electrodeposition increased with the increasing of the pulse period. The copper foil of DC static electrodeposition or DC stirring electrodeposition at a low speed with a smooth surface, small tissue could be obtained at the current density of 300 A/m², but it could be better at the current density of 400 A/m² at a high strring speed. The compact and uniform copper foil of static pulse electrodeposition could be obtained in period of 10²0 ms at 45℃.The tensile strength of the DC stirring electrolytic copper foil (98.5 MPa) was higher than the DC static electrolytic copper foil (125 MPa), and the tensile strength of the pulse electrolytic was the lowest (54 MPa).The results showed the optimum additives parameters: CuCl₂·2H₂O:1.6g/L; gelatin: 0.02g/L; thiourea:0.01 g/L; dodecyl sodium sulfate: 0.01g/L.