Design And Realization Of Ultrasonic Test Instrument For Semiconductor Package

Ultrasonic testing is one of important method of NDT (Non-destructive Testing). It has been widely used in metallurgy, reconnoiter, production quality control and safety supervising. It is non-substituted in the semiconductor field because of high speed and high accuracy.By using MCU (Microcomputer Control Units) and EPLD (Erasable Programmable Logic Device), a digitized ultrasonic wave pulse reflection crack detection system is developed. MCU has small volume, low price, high dependability, and EPLD has easily operating I/O ports, high speed operation ability, which can realize most of functions such as signal emitting, incepting, magnifying, data collecting and processing, displaying graphics, determinant defects. The storage problem of traditional ultrasonic testing system is solved, and some infection factors of handlers are reduced. In virtue of technology of digital analysis and processing, the Signal-to-Noise is progressed, and testing reliability is improved. A very good foundation is established for the research of ultrasonic image testing.In the ultrasonic-reflection-crack-detection system, modularization designing is used to increase system maintainability. The system uses chip with lower noise and excursion, higher precision and dependability to increase the stability of hardware system. The system also has large LCD, touch keyboard and the Chinese operation interface to make operation easier. Though the system has such strong functions, it still keeps properties of small size, simple structure and low cost.