Research On Modeling And Simulation Of Boundary Heat Transfer Process Of High-Power IC Chip

With advance of electronic chip integration level continuously and boost of performance increasingly, more and more people start to pay attention to the heat transfer problem of electronic product that have been a great obstacle to develop integrate circuit and great integrate circuit. According to thermal design of electronic product, we think generally that the heat transfer problem of electronic product includes two aspects: one is the heat transfer between integrated circuit chip and its submarine in chip, the other is the design of heat removal on chip's crust, and these aspects are relative to their thermal boundary resistance which decide the performance and reliability of electronic product in great extent. Therefore the research to thermal boundary resistance is a very important to solve heat removal on chip.The thermal boundary resistance between solids has been several decades research history, and the problem of boundary heat transfer has been expanded from initial problem of liquid and solid to the other boundary heat transfer between matter state such as between solids, and become an research hot in heat transfer as well in view of its wildly application background and great scientific significance. In the dissertation, the research achievement are introduced and summarized, and by using others' experiment method for reference, experiment system for measure of temperature and thermal power is designed, and then identification, built-up model and digital simulation to thermal transfer process base on the thermal transfer theory is introduced in detail.Firstly, mechanism of boundary heat transfer between solids is explained;Secondly, others research and method of build-up experiment are introduced, and the process and characteristic of boundary heat transfer between celeron 300 CPU and aluminium coolinger are analyzed, and a particular method based on thermal balance principle for measuring CPU chip thermal power and temperature collection system is introduced, and experiment process are explained in detail. Thirdly, Owing to the complexity and particularity of boundary heat transfer process, A new built-up model method and techniques were suggested in this dissertation, it can combined the mechanism model method with identifier of model parameter so that can solve built-up model problems of complex process such as boundary heat transfer. Based on the pan-Boolean algebra and experiment data of thermal boundary resistance, the simulation model of CPU chip -aluminium coolinger thermal boundary resistance has been built up successfully;In addition, the simulation model of binary simple and binary quadratic regression analyses on thermal boundary resistance between CPU chip and aluminium coolinger was described in this dissertation according to their experiment data. At the same time, the simulation model of least square method was also discussed.Finally, it is introduced in this dissertation that boundary heat transfer process of CPU chip were simulated by graphical user interface of MATLAB. The method and operation process of compiling M file are introduced,.because M file in MATLAB can't be executed exactly without MATLAB table.