Analysis Of The Interconnect In Microwave Multi-chip Module By Parallel FDTD Technique

With the tremendous development of the micro-electronics technology, the miniaturization and high-density packaging of the electronic system have become a trend. During the past half century, the microwave circuit has passed through the course that is either from low frequency to high frequency or from single layer to multiple layers and the microwave multi-chip module (MMCM) comes into being ultimately. However, the system signal speed is becoming faster and faster increasingly and the parasitic effect caused by the interconnect and packaging in MMCM is also becoming more and more serious, which has become the limiting factor for the whole system performance. In multiple layers MMCM, the transmission line-via-transmission line is a very typical interconnect model and the vertical via interconnect is often used to connect the transmission lines in different layers, so the study on this type of interconnect is very important for the modem electronic system design.Firstly, this thesis introduces the basic theories of FDTD, and then a new Conformal FDTD (CFDTD) method is studied by synthesizing two types of conformal FDTD methods. The scattering parameters of two different via-hole grounds in single layer microstrip are analyzed by our CFDTD method. Followed this, MPI-based Parallel FDTD (P-FDTD) algorithm in PC Clusters is introduced. Microstrip-via- microsrip and microstrip-via-strip are simulated by the P-FDTD method and their scattering parameters are also analyzed. Lastly, taking the microstrip-via-microstrip as an example, this thesis discusses the parallel performance of MPI-based P-FDTD in detail and two conclusions are obtained, which are helpful to study the more complex interconnect and packaging in VLSI further.