Fabrication Of Continuous-wave High Power Semiconductor Laser

Falling threshold and increase power is the main goal of continuous-wave high-power semiconductor laser. Temperature affect the characteristic of lasers. Heat need to spilt out in time. Design and manufactur of lasers is studied.Thermal resistant materialize heat characteristic of lasers . Temperature affect is important to system design. Transient and stationary thermal characteristic of semiconductor laser were simulated by ANSYS software. Influence of the carriers and the solders is simulated. Thermal resistant of the laser was also measured by vertical-mode spectrum method, the results were basically coincident with the simulations.Laser chip is inverse welded on the carrier. The Indium and Pb/Sn solders that were commonly adopted in China are both soft solders. Soft solders exist reliability problems such as whiskers growth and thermal fatigue. In order to improve reliability of sintering, a new technique of sintering laser with Au/Sn solder was adopted. The technology of manufacturing Au/Sn solder and sintering was mastered by experiment research. The characteristic difference between Au/Sn, Indium and Pb/Sn solders was studied with experiment. The experiment's results show that the lasers sintering with Au/Sn solder can obtain better capability than others. The technique of sintering with Au/Sn solder is a effective way to improve reliability of semiconductor laser.