Research On The Application Of Laser Direct Writing Technology

With the development of large-scale intergrated circuits, laser direct writing technology was presented as a new technology of circuit board manufacturing in the mid-1980s. With having the characteristics of high precision, short period, easy operation and low cost, laser direct writing is considered to have prospect towards industrialization, and becomes the research hotspot. In this paper, the physical foundation of reciprocity of Laser&Materials was discussed. The conductive lines and resistors were fabricated directly on glass. At the same time, the concerned fundamental technical problems were studied systematically. The effects of spin coating technological parameter and laser processing parameters on thickness and linewidth were studied systematically, which are both important parameters to characterize the conductive line quality.The first experimental procedure was spin coating and coating- drying heating ,to prepar the electronic paste, then scanned the paste according to preset orbit by laser beam. The untreated area could be cleaned by organic solvent, and the conductive patterns which we needed were left. The last procedure was sintering the patterns. According to aboveprocess, the nickel conductive lines with minimum linewidths of 110μm was fabricated onglass substrate by the use of the focused Nd:YAG laser to irradiate the conductive paste coating. The conductive lines had the smooth surface. The adhesive strength between conductive lines and substrates was strong, while the resistivity of conductive lines can reach the level of 10^-4Ω·cm on glass substrate, which could meet the demands for industrial applications.