Research On Modeling And Simulation Techniques Of Thermal Analysis On The Chassises

With the rapid development of the microelectronics technology, as well as the appearance of multi-chip module (MCM) and three-dimensional high-density assembly technology, the heat flux density of the electronic devices are getting higher and higher. Thus how to get a scientific and rational design of electronic equipment to meet the requirements of thermal performance is of great concern to engineers. Based on the theory of heat transfer and fluid mechanics, the thermal analysis models of an chassis and its power supply module are established, and simulation technology research is carried out with engineering software.Firstly, the effect of the grid interface connection and turbulence model on temperature field distribution has been studied, and the effectiveness of CFX has been verified in electronic equipment thermal analysis.In modeling, after the moderate simplification of the model, the interference of the flow channel model of typical cooling chassis has been studied, and the flow channel model suitable for thermal analysis is generated through the use of enclosure feature.In thermal analysis, a professional mesh generation software ICEM-CFD is used to generate full-hexahedral grid and realize the grid assembly which is then imported to CFX to carry out the solution. Finally the modeling and simulation method are verified to be reasonable through the analysis of simulation results, which has provided a basis for the further optimization of the chassis structure, and has a certain engineering application value.