Low-k Wafer Dicing Project Optimization Study

Low-k application including in assembly process is sucussful and deep study in world wild, while it is almost blank in China.So,we would benchmark international experience to study advanced assembly technology and modern project management experience as well as training our localized technical engineer and project management expert through this project.This paper described the cross-function project of quality study which is low-k dicing quality optimization and process capability verification in Amkor Technogy. With many years working experience in semiconductor field and project management learning, Author organized with strong matrix type project organization TFT (Task Force Team) and maintained this project sucuessfully base on IT project character and modern project management tools; This project applied Total Quality Management methodology and exact the management which cover all factors, all personnels and entire progress.Main tool application is like milestone, WBS (Work breakdown Structure), Responsility matrix, Gannt chart, Fish bone, Project check list, Orthogonal design of experiment, Control chart and process capability index analysis etc.The paper analized deeply low-k dicing mechanism and quality character; Focused on experiement model founding from DOE (Design of Experiment) principle and orthogonal DOE table,Optimized stable process condition through DOE method which is screen design and custom design in JMP.Finally study process stability through SPC (Statistic Process Control) control chart with process capability verification; Achieved project goal which is CPK over 2.0 index and cost saving; Finally dug out project management method is possible to optimize process quality also this is invitable trend of quality management.