Design And Implementation Of Temperature And Pressure Control System For Rfid Chip Packaging Equipment

With the Radio Frequency Identification System (RFID) is widely used in the transport, railways, postal and other industries, electronic tags plays a key role in the process of information technology. At the same time, the production techniques and manufacturing equipment have been confined the low-cost production of electronic tags,Which become the biggest obstacle to its popularity.This dissertation has studied electronic tag's package process, namely the Flip Chip Electronic Packaging process based on the conductive adhesive, and has described its production technology and manufacturing processes. The bonding system's mechanical structure is designed based on the requirements of manufacturing method, Design and implementation of temperature and pressure control system according to the conductive adhesive's technological parameter request.This paper focuses on doing the following areas: First, according to the production of RFID technology, designed the overall structure and the functional part of the mechanical structure of the packaging equipment; Second, designed temperature control system, has carried on collecting, filtering and display to the temperature signal, to achieve MCU-based PID temperature control system; Third, pressure control system is designed to achieve a pressure signal acquisition, display and control; At last, Visual C++ application software to complete the design, using the motion controller to complete motion control and to achieve the MCU and PC communication.