Numerical Simulation Study Of The Influence Of Magnetic Field On The Capacitive Coupled Plasma And Inductive Coupled Plasma

In the field of semiconductor industry, the capacitive coupled plasma and theinductive coupled plasma are widely used in the process of surface modification,material etching and thin film deposition and so on. Especially, the plasma enhancedchemical vapor deposition based on the above two kinds of plasma have theadvantages of low temperature, fast deposition rate, and film forming good quality isnot easy to crack, so it is important for thin film deposition technology insemiconductor industry. Numerical simulation is one of the main means ofoptimization design of basic research and related industrial equipment in of ICP’s andCCP’s various physical and chemical processes. Through numerical simulation, notonly a variety of physical processes contained can be understanded, but also accuratequantitative results can be given, thereby significantly reducing industrial equipmentdevelopment cycle and cost. Therefore, the ICP and CCP research based on thenumerical simulation become one of the hotspots of research, with a large number ofrelevant work.Oxygen discharge of CCP or ICP used to deposit the oxide film and plasma cleaningand dedust process, has wide application in the industry, thus obtained the widespreadattention and research. In the ICP and the CCP discharge, electron density andtemperature are low, discharge current is very small, so usually electric field is muchbigger than the magnetic field. In most cases its own magnetic field can be completelyignored, the influence of weak external magnetic field can makes the electronmagnetized and thus greatly change the nature of the plasma. On the one hand, peoplehas extensive research against oxygen discharge of CCP and ICP, but published are notfocus on the magnetic field conditions; On the other hand, people also have a thoroughunderstanding of the influence of a magnetic field on the plasma discharge, but most ofthe recent research is electropositivity argon discharge. For the influence of additionalmagnetic field on oxygen discharge, there is no relevant work published, especially theinfluence of additional magnetic field on the plasma density, electron temperature,voltage, and power deposition density, etc. Fluid model and PIC/MC (Particle-in-cell/Monte Carlo) model are two kinds ofnumerical simulation method commonly used in Low temperature plasma. Fluid modelhas small amount of calculation and good stability, and is easy coupled chemicalreaction module. Fluid model has been developed a2d or3d, the wholeelectromagnetic algorithm, is widely used in optimal design of the related industrialequipment. Using the method of fluid, this paper studies the influence of additionalmagnetic field on the plasma density, electron temperature and ion, electron energydistribution function which reveals that the effect of magnetic field enhanced ICP andCCP discharge for oxygen discharge to provide the reference for the oxide thin filmpreparation, plasma cleaning to ashes and related technology.The first chapter simply introduces the concept of plasma and several commonplasma source and the research progress of thin film deposition.The second chapter introduced the fluid mechanics model and electronics MonteCarlo used in simulation.The third chapter mainly simulates oxygen discharge change after joined externalmagnetic field based on cylindrical capacitively coupled plasma model. The resultsshow that electricity gas is easy to convergence than negative electricity gas and theplasma density increases with the increase of magnetic field. This is due to electroncyclotron radius decreases with the increase of the external magnetic field, thuselectron mean free path decreases and the electronic behavior is restricted. Magneticfield caused the sheath thickness thinning, also makes the low-energy particles shareincrease of ion energy distribution function.The third chapter mainly simulates oxygen discharge change after joined externalmagnetic field based on cylindrical inductively coupled plasma model. The resultsshow that plasma density decrease with the increase of magnetic field. We discuss thereason why the plasma density reduced, the electron energy distribution function andthe electron temperature change with magnetic field increase are presented for furtherdiscussion.