Three-dimensional Displacements Measurement Methodology Based On FPGA And Strain Measurement Of Stranded Wires

Digital image correlation method is a very important photomechanics method. Throughout many decades’ development, it has been a well-established technology and widely used in architecture, aviation field etc. This paper pushes forward application of DIC method.Three-dimensional displacement is an important mechanics component in engineering measurement and mechanics analysis. This paper proposes a method using 2D digital image correlation combined with fringe pattern profilometry to measure three-dimensional displacements. This process is done by FPGA system and four-dimensional interpolation. Only image acquisition camera and one projector with FPGA system are needed. It’s very convenient to fulfill the experiment and the accuracy can satisfy engineering demand.Another part of this paper aims at application of two-points DIC used to measure strain of stranded wires. Numerical simulation-guided idea is introduced. Numerical simulation is adopted to comprehend general deformation as experiment guidance. Only image acquisition system is employed and the result has high accuracy, which shows virtues of easy-operated and high accuracy.