Study On High Thermal Conductive Adhesive For Rich Resin Mica Tape

In this paper, Tong Ma anhydride-epoxy system was seleted to prepare adhesive for mica tape of rich resin. In the experiment, the adhesive was sythesized with tung oil, maleic anhydride, bismaleimide and 6101 epoxy resin. Aluminum oxide, silica, boron nitride, aluminum nitride were employed as thermal conductive fillers. After certain physical and chemical surface modification on the thermal conductive filler, the adhesive with high thermal conductivity was prepared by solution blending.Factors of gel time for adhestive were studied, the results shown that adhesive would meet the requirements when the ratio of curing accelerator and epoxy resin was 1:300, and the gel time would be firstly shortened and then extended with the storage time. Whether the thermal conductive fillers were modified or not were studied as a factor of conductivity of adhesive, the result showed that the adhesive dopped with the modified fillers had a higher conductivity than the one dopped with unmodified fiilers. The modifiing effect of fillers with the type and the usage of the coupling agents were studied, the result showed that the best type is DB560, and the optimal usage is 3wt%.The optimal method for mixing was method B.The optimal method of adding fillers for BN is method A, and the optimal method of adding fillers for Al2O3、SiO2、AlN is method B. The optimal process for fillers dispersion was process B. The high thermal conducitive adhesvie dopped with single filler was prepared, and the infience of the usage, the shape,the crystal shape, and the type of the fillers on the conductivity and electrical properties for adhesive were studied. The result shown that the optimal usage of fillers is 32vol%,the adhesive dopped with spherical SiO2 had a higher conductivity between the two shapes of SiO2, the larger the size of fillers were, he higher the conductivity of the adhesives dopped with them were, the adhesive dopped withα-Al2O3 had a higher conductivity between the two crystal shapes of Al2O3, on the same usage, the adhesive dopped with 30nmα-Al2O3 or 5μmBN had the highest conductivity. The adhesive dopped with two or three types of fillers were prepared with different fillers, and conductivity and electrical properties were analyzed.The result shown that theα-Al2O3 dominated dopping program of two fillers are superior to the BN dominated program of two fillers. In the dopping program of three fillers, the adhesive dopped with 28 vol% 30nma-Al2O3、4 vol% 70nmBN and 0.8 vol% 10nm pore shape SiO2 had the highest conductivity, which is 0.287 W/m·K.