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Numerical Simulation Of Flow And Heat Transfer In Polysilicon Reduction Furnace’s Baseboard

Posted on:2014-07-27Degree:MasterType:Thesis
Country:ChinaCandidate:Y ZhouFull Text:PDF
GTID:2181330422968315Subject:Chemical Engineering
Abstract/Summary:PDF Full Text Request
A theoretical model to describe the flow and heat transfer phenomenon inpolysilicon reduction furnace has been proposed by combining computational fluiddynamics and heat transfer. A comparison is performed with the temperatureuniformity, cooling effect against the traditional reduction furnace.First, siemens process energy consumption can be limited by furnace’s baseboardtemperature. The baseboard of the traditional polysilicon reduction furnace is adouble-helix-channel baseboard. The cold water passes from the entrance and throughthe double-helix channel and to the outlet. This type of baseboard has a good coolingperformance, non-uniform temperature. The concrete performance shows temperaturedistribute from high to low through the channel. An analysis is presented which,based on mass and heat transfer theory, studies different types of baseboards and anew type of baseboard structure is studied in detail in this paper. This new type iscontained of two chambers cut by a barrier where several sleeves, around theelectrodes, are welded to. When the furnace is in work, the cold water, which passesthrough the sleeves from the lower chamber to the upper chamber, takes the heat fromthe hot electrodes and the furnace’s baseboard. The baseboard temperature of higherdegree of uniformity and worse cooling performance is realized in this type ofbaseboard compared with the traditional ones.Secondly, the effect of flow geometry parameters on heat transfer for turbulentflow in the sleeves with baffles inserts has also been investigated. Different flowgeometry parameters of baffle width (W), baffle thickness (T), pitch (P) were variedparametrically during the experiments. Water, temperature of which is300k, was usedas working fluid, while stainless steel was considered as sleeve and baffle material.The best effect of cooling performance is the type with the parameters of Wb=1mm,Tb=1mm, Pb=10mm;Wt=1mm, Tt=1mm, Pt=10mm and prompts32%increase in heattransfer effect and54%in uniformity of temperature.At last, the effect of flow geometry parameters on flow resistance for turbulentflow in the sleeves with baffles inserts has also been investigated. Different flowgeometry parameters of baffle width (W), baffle thickness (T), pitch (P) were varied parametrically during the experiments. There are some corresponding relationshipsbetween the cooling performance and flow resistance, that is, better coolingperformance with the higher flow resistance and worse cooling performance with thelower flow resistance. And a pressure drop of inlet and outlet allows us to characterizeflow resistance. The highest pressure drop is about1200Pa.
Keywords/Search Tags:Polysilicon reduction furnace, Computational fluid dynamics, heat transfer, flow resistance
PDF Full Text Request
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