Effect Factors Of Experiment Research On Electrodeposition Of Copper By The Packed Bed Electrode Reactor

Removing the copper ion from the wastewater by using electrodeposition methodand the packed bed electrode reactor as the main process. Using SEM, XRD, CV,polarization curve and EIS analysis means to describe the physicochemicalcharacteristics of the electrodeposition of copper, application research on oxidation oforganic matter "step-reaction kinetics", with measure for concentration c(t)/c0, theaverage current efficiency (ACE) and energy consumption (Esp). Validationstep-reaction kinetics can predict the electrochemical behavior of theelectrodeposition of copper. The concrete conclusion is as follows:(1)By comparing the SEM of Flow way, electrodeposition time, velocity, andcell voltage to be seen: under the condition of dynamic, electroplating time is6h, theinlet velocity of0.6L/h and the cell voltage is6V, plane of crystal ofelectrodeposition of copper accumulate more closely, copper electrodeposition effectis obvious and the removal rate is higher.(2)By comparing the XRD of flow way, electrodeposition time and velocity to beseen: it is generated by the elemental copper, it is easier to grain grew up under thecondition of dynamic; As the extension of time of electrodeposition, the formation ofcrystal nucleus rate is greater than its growth rate, grain size reduced. And bycomparing the size of the crystallinity, the electrodeposition of the grain size ofcopper particles distribution more rules under the condition of dynamic,electrodeposition time is6h, flow rate of0.6L/h between various contrast conditions.(3)When filled with activated carbon, its active site number is greater than thenon-packed bed, copper evolution overpotential and exchange current density arebigger, resistance decreases, thus copper electrodeposition effect is better. Increasingcopper ion concentration, the current density values of restore of the peak is increased,copper evolution overpotential, exchange current density and value of β are bigger,resistance decreases, thus copper electrodeposition effect is better. With the increaseof scanning speed, current density values of restore of the peak is increased in the CVcurve.(4)Validation step-reaction kinetics main consider factors affecting of the masstransfer coefficient such as cell voltage, copper ion concentration, flow velocity andplate spacing, it is highly relevant through the different conditions of theoretical valueand experimental value correlation analysis, thus it can prove that step-reaction kinetics describing the electrochemical behavior of the electrodeposition of copperhas quite high accuracy.