The Research Of Cu/Al (Zn) Laminated Compound Materials Fabricated By Solid-liquid Bonding Method Under The Condition Of Pressure

With the growing shortage of copper resources, copper price is stay high, so thedevelopment of new materials to replace copper become an inevitable trend.Aluminum and zinc resources are very abundant in China, and their price is lower thanthat of copper. Cu/Al (Zn) laminated compound materials have the advantages ofcopper and aluminum (zinc), and they have good comprehensive properties. For now,the metallurgical interfaces of laminar composites produced by current main methodsare not ideal, and have high production costs. How to realize the reliable and economiccomposition of copper and aluminum (zinc), has become a problem to be solved.laminated compound materials which are preparation by solid-liquid bonding methodhave obvious advantages in terms of performance and price.In this research, Cu/Al (Zn) laminated compound materials were fabricated bysolid-liquid bonding method under the condition of pressure. The bondingperformance of composite interfaces and organizational structure were studied usingelectron-tensile tester, microhardness tester, scanning electron microscope (SEM),energy spectrometer (EDS), transmission electron microscope (TEM) and X-rayanalyzer (XRD). The influences of pouring temperature on the interface layerthickness, tensile strength, interface layer structure were researched. In addition,interface layer hardness distribution, structure characteristics, and the tensile fracturereason wre explored. The main conclusions are as follows:1. The Cu/Al (Zn) laminated compound materials with good metallurgicalbonding can be made by solid-liquid bonding method under the condition of pressure.2. As Cu-Al bonds, aluminum pouring temperature has a significant effect on theformation of metallurgical bonding interface layer, the thickness of the interface layerand the bonding strength of interface layer: when pouring temperature is low,metallurgical bonding interface layer do not form, and the tensile of interface is low; when pouring temperature is720℃, metallurgical bonding interface layer is beginningto form, and the tensile is highest, reaching40.07MPa; with the increase of pouringtemperature unceasingly, interface layer thickness increases, and the tensile strength ofinterface decreases.3. As Cu-Al bonds, metallurgical bonding interface layers show the followingcharacteristics:(1) From aluminum matrix to copper matrix, the inner layers thickness decreasesgradually, and the phases are α-Al+CuAl2, CuAl2and CuAl respectively.(2) The hardness of interface layer is higher than the matrix hardness significantly,and the hardness is highest in interface near copper matrix, reaching240HV.(3) The tensile fracture surface contains a lot of CuAl2phase, and fracture occursmainly in the interface with CuAl2. The CuAl2brittle phase generated in interfacelayer is one of the main reasons of causing the composite material fracture.4. As Cu-Zn bonds, zinc pouring temperature has a significant effect on theformation of metallurgical bonding interface layer, the thickness of the interface layerand the bonding strength of interface layer: when pouring temperature is420℃,metallurgical bonding interface layer with a transition layer about8μm is beginning toform, and the tensile is highest, which is higher than the tensile strength of zinc matrix(40.86MPa); with the increase of pouring temperature, interface layer thicknessincreases, and the tensile strength of interface decreases.5. As Cu-Zn bonds, metallurgical bonding interface layers show the followingcharacteristics:(1) The main intermetallic compound generated is in interface layerly is CuZn (βphase), and with the increase of pouring temperature, intermetallic compoundsincreases.(2) The interface hardness of Cu/Zn laminated compound materials is differentfrom the hardness of copper and zinc base, which is higher than the matrix hardnesssignificantly, and the highest hardness is472.1HV; hardness is different at differentpositions in the internal interface layer.