Low Dielectric Constant Polyimide Film Prepared By CF4Plasma Treatment

With the development of integrated circuits, the signal transmission delay and losshas become a big problem. To solve this problem, the new base material with lowdielectric constant and dielectric loss will be the key point.CF4plasma treatment was used to polyimide film and introduced fluoric group ontopolyimide film in this paper. The contact angle and XPS were used to confirm the fluoricgroup has been introduced on polyimide film successfully. With treatment power andtreatment time up, the dielectric constant and dielectric loss obviously drops in lowfrequency area (1Hz to1e+2Hz). At the optimized condition, the average dielectricconstant changes from2.7to1.9(1Hz to1e+2Hz), and the average dielectric losschanges from0.145to0.06(1Hz to1e+2Hz).Meanwhile the decrease of dielectricconstant&dielectric loss has positive correlation with fluorine content of material.