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The Influence Of Resin’s Structure On Mechanism Of Gradient Coatings

Posted on:2013-05-14Degree:MasterType:Thesis
Country:ChinaCandidate:Z H TanFull Text:PDF
GTID:2181330467484801Subject:Physical chemistry
Abstract/Summary:PDF Full Text Request
Silicone coating as a very good antifouling coatings can be widely used in Marine shipbuilding industry.Although organic silicone coating has a good antifouling performance, it still exist problem that the adhesion to the bottom anticorrosive epoxy is not good, this problem will affect the service life of coating. Therefore it is very important to improve the adhesion between the antifouling coatings and anticorrosive coatings. Due to gradient coating can improve adhesion between the multilayer coatings, so can be applied to solve this problem.This article have study the gradient coating by determining the solubility parameter of different resins and curing agents, determining the volatile rate of solvent on the substrate, determining the influence of curing agent dosage and curing temperature to the curing rate of anticorrosive epoxy coatings.Determined the solubility parameter of epoxy resins and curing agent by the Hansen’s standard method in different temperature, and known the effects of the temperature on the solubility parameter, known the compatibility of epoxy resin and curing agent in different temperatureThrough the solvent volatilization device by ourself, determined volatile rate of the pure solvents on the filter paper and low carbon steel, determined volatile rate of mixed solvents on low carbon steel, established Solvent volatilization model on low carbon steel which can provide the reference to the choice of coatings’ solvent.Using the viscometer to determine the rheological propertiesof, inspected the influence of the curing agent types, dosage of curing agent, temperature on curing rate, and set up curing rate equation of two systems, and compared this results with that results which determined by DSC.
Keywords/Search Tags:self-stratification, solubility parameter, solvent evaporation rate, curing kinetic, rheological properties
PDF Full Text Request
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