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The Curing Behavior And Properties Of Epoxy Resin TGDDM

Posted on:2016-05-10Degree:MasterType:Thesis
Country:ChinaCandidate:S T ZhangFull Text:PDF
GTID:2181330467492640Subject:Materials engineering
Abstract/Summary:PDF Full Text Request
TGDDM is widely used in the field aircraft manufacturing because of its excellentmechanical property and heat resistance property. In the normal progress of curing, a relativehigh temperature is needed which will increase the internal stress and impact the property ofthe material: A lower temperature curing progress is energy efficient and easy to implement,which could affect the nature of the material. Aimed to get the TGDDM cured at relative lowtemperature with high heat resistance and high strength, a method of mixing two types curingagents in the TGDDM curing system was studied. To find a curing system which couldproduce high quality product and meet the low temperature requirement, the ratio of the twokinds of curing agents was adjusted.The curing system TGDDM/DDS/DDM (TSM) consist of curing agents DDS and DDM.The rheology property, the gel time research, the mechanical properties, the morphology andthermal properties of three resin systems was investigated, then the most premium resinformula (TSM-3) was got; the TSM-3resin system curing reaction and curing behavior wasmeasured by differential scanning calorimetry and FTIR. The results show that: The TSM-3system met the requirement of curing at low temperature and the material possesses excellentthermal stability while the mechanical properties still need to be improved.The curing system TGDDM/DDS/JH (TSJ) was made up of curing agents DDS and JH.The rheology property, the gel time research, the mechanical properties, the morphology andthermal properties of three resin systems was investigated, then the most premium resinformula (TSJ-3) was got; the TSJ-3resin system curing reaction and curing behavior wasmeasured by differential scanning calorimetry and FTIR. The results show that: TSJ-3resinsystem could possess excellent mechanical properties in a relative low curing temperaturewhereas the improvement of the thermal resistance was not obvious. The curing system TGDDM/DDM/JH (TMJ) was composed of curing agents DDM andJH. The rheology property, the gel time research, the mechanical properties, the morphologyand thermal properties of three resin systems were investigated, then the most premium resinformula (TMJ-1) was got; the TMJ-1resin system curing reaction and curing behavior wasmeasured by differential scanning calorimetry and FTIR. The results show that: TMJ-1resinsystem could possess excellent thermal stability and good mechanical properties at the lowestcuring temperature. The TMJ-1system met the requirement of curing at low temperature.
Keywords/Search Tags:epoxy resin, TGDDM, curing behavior, low curing temperature
PDF Full Text Request
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