The Feasibility Study Auout AB Company Introducing New Plating Process

AB Company is a foreign invested semiconductor assembly and test plant which locates in Shanghai China. With rapid development of semiconductor industry, competition is getting hot. Plating is one very important part of semiconductor industry chain. As one part of requirements from Rohs, lead free plating is becoming one bottle neck restricting development of many semiconductor companies. AB Company has developed pure tin plating process with following Rohs requirements. But it is still can not meet some customers'requirements. AB Company decides to develop one new lead free plating process based on real situation and customers'requirements. This article is to study feasibility of this project.Investment background of this project was introduced firstly in this article, status and foreground of semiconductor industry was summarized. Background and progress of lead free requirement was also introduced in chapter.Secondly this article analyzed several circumstances of semiconductor industry development with using PEST analysis method. The status and trend of semiconductor industry was introduced in this chapter. At the same time market status and trend of lead free devices was described based on data from AB Company.Optimum lead free plating process was selected with using SCORING Model in the following chapter.Investment conditions of this project was analyzed which include plant size, production scope, capability of machine and facility.Finance analysis was performed in last chapter. Total investment, income and cost of this project were estimated. Financial assessment was performed which comprise of the rate of profit, the period of recovery, net present value and equilibrium analysis, repay debt analytic and sensitive analysis.Through analysis on project income, expense, property liabilities, cash flow and income statement, it is concluded that this project is economical and feasible.