Buckling Study Of The Circular Electrode Delamination On The Piezoelectric Substrate

With the rapid development of intelligent materials, the laminated structure function devices made of intelligent materials have been applied in the field of scientific research and life. However, the laminated structure functional devices always laminate and buckle in the interface between the layers under the action of external force, which seriously affect the work efficiency of the functional devices. So it has directive significance for the structural design of the functional devices to study the mechanical behavior of the laminated structure with interface delamination during the effect of pressure load.In this paper, a laminated analytical model of metal electrode and semi-infinite thickness piezoelectric is established. The analytic method and finite element numerical simulation method are used to study the buckling problem of circular delamination exist in the interface between layers from theory and practice respectively. The influence of the ratio of radial dimension to thickness of the delamination and the piezoelectric effect of the piezoelectric substrate on the critical buckling strain of the metal electrode are studied. At the same time, the influence of the structural radius and the thickness of the substrate on the critical buckling load are also studied in the finite element numerical simulation method. The study results show that the piezoelectric effect of the piezoelectric substrate has little effect on the buckling of the metal electrode; When the ratio is relatively small, the critical buckling strain is large. With the increase of the ratio, the critical buckling strain decreases rapidly, and then changes slowly and tends to be stable.