The Preparation Characterization Of Hollow Carbon Sphere And Epoxy Resin Composite

The micro-scale hollow carbon microshepers (M-HCMs) and nano-scale hollow carbon microspheres (N-HCMs) were prepared. The SEM, FTIR, XPS and Raman were used to characterize the microstructure of the HCM. And then the HCM/epoxy compoistes were prepared by introducing HCM. Based on the surface structure analysis of HCMs, the effects of HCM content and particle size on the mechanical properties, dimensional stability, thermal conductivity, thermal stability and dielectric properties of epoxy resin were investigated. The density of the HCM/epoxy composite gradually declined with the increase of micro-scale HCM (M-HCM) content up to 9wt%, and the compression strength of HCM/epoxy just decreased slightly, while the compression modulus and flexural modulus were enhanced continuously. When 1wt% HCMs were involved, the reinforcing effect of nano-scale HCM (N-HCM) was superior to the M-HCMs, and the compression strength and flexural strength of N-HCM/epoxy resin were almost equivalent to the neat epoxy. The dimensional stability and thermal stability of HCM/epoxy composite were also improved with the addition of HCMs. Besides, the introduction of the M-HCMs and N-HCMs gave rise to the different effects on the thermal conductivity, electrical conductivity and dielectric constant of the HCM/epoxy composite due to the diversity in the interfacial interaction and microstructure. These results indicate that the HCM/epoxy composite show potential application values in multifunctional materials with lightweight and high rigidity.Based on the research of N-HCM/epoxy composte, the aggregation of N-HCM appeared in the N-HCM/epoxy composite with the loading of 1wt% N-HCM. In oreder to further research the influence of the N-HCM on the properties of the epoxy resin, the N-HCM/epoxy composites were prepared with the N-HCM contents 0.2wt%,0.5wt%,0.8wt%,1.0wt% respectively. The flexural peoperty, thermal conductivity, dimensional stability, thermal stability, and dielectric property of the N-HCM/epoxy composite were investigated in detail. The results releaved that the N-HCM/epoxy composite with 0.5wt% N-HCM showed superior performance. The dimensional stability and dielectric peoperty of the N-HCM/epoxy composite increased with the increasing N-HCM contents.Acorrding to the bad compatibility between the N-HCM and epoxy resin, the N-HCM was modified with dopamine coating (PDA@HCM) to improve the compatibility of N-HCM and epoxy resin. The PDA@N-HCM/epoxy composites were prepared with the N-HCM contents 0.2 wt%,0.5wt%, 0.8wt%,1.0wt%, respectively. Also, the flexural peoperty, thermal conductivity, dimensional stability, thermal stability, and dielectric property of the PDA@N-HCM/epoxy composite were investigated in detail. The results demonstrated that the PDA@N-HCM/epoxy composite with 0.5wt% PDA@N-HCM showed superior performance. The dimensional stability and dielectric peoperty of the PDA@N-HCM/epoxy composite increased with the increasing PDA@N-HCM contents. Compared to the N-HCM/epoxy composite the PDA@HCM/epoxy composite showed better peformance.