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Characterization On The Inter-diffusion Layer Produced During Heating Of Beryllium Bronze With A Coating Of Ti And Computer Simulation Of Ti Concentration Profiles In Inter-diffusion Layer

Posted on:2016-04-24Degree:MasterType:Thesis
Country:ChinaCandidate:R L LiFull Text:PDF
GTID:2191330479490446Subject:Materials science
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Considering the wear property of copper–beryllium alloy(Be Q2.0) is relatively poor, titanium-copper thermo-reactive diffusion layers were produced on the surface of copper–beryllium alloy by Ti deposition with magnetron sputtering method and diffusion process to improve the wear property. Energy dispersive spectrometer(EDS), scanning electron microscope(SEM), X-ray diffractometer(XRD),optical microscope(OM), pin-on-disk tribometer and micro-hardness test were used to analyse and chatacterize the duplex layers.The Ti film obtained by magnetron sputtering is smooth, densified and homogeneous. The Ti film is mainly constitutes by α-Ti has a(002) preferred orientation.The modified layer, which mainly consists of phase Cu Ti2、Cu4Ti3、Cu3Ti2、Cu3Ti、Be3Ti2Cu, was obtained during the Cu-Ti thermo-reactive diffusion. Modified layer surface quality is good, with the increase of time and temperature rise, each component content in the modified layer showed regular changes. The thickness of the modified layer increases with temperature rise, but the relationship between them is not the positive correlation.The presence Ti-Cu intermetallic compounds improved the hardness and the wear resistance of the copper–beryllium alloy significantly. 751HV0.010 hardness, 0.3-0.5 friction coefficient and rather low wear rate were obtained at 700℃,6h. The main wear mechanism is turned to oxidation wear instead of adhesive wear.The standard aging process after the previous processes improved the hardness of the base part of the specimen from almost 100 HV0.010 to higher than 300 HV0.010 and didn’t change the quality of the duplex layer.The physical models of Titanium concentration profile for Ti plating beryllium bronze which were thermal diffused in 650 ℃, 700 ℃, 750 ℃ three temperature were established. The mathematical analytical solution was solved, and the numerical results were given. Comparing the numerical results with 5 groups of experiment results, the simulation results are proved to be highly consistent with experimental results.
Keywords/Search Tags:Cu–Be alloy(QBe2.0), Titanium plating, thermal diffusion, Titanium concentration profile, computer simulation
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