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Thermal Simulation Research On Titanium Ring Rolling Used By Electrodeposited Copper Foil

Posted on:2016-11-09Degree:MasterType:Thesis
Country:ChinaCandidate:T Z ZhouFull Text:PDF
GTID:2191330479951182Subject:Materials Processing Engineering
Abstract/Summary:PDF Full Text Request
Copper foil is the key materials for printed circuit board, and depositing copper foil is an effect way to produce copper foil. The titanium cathode roller is the key part for the equipment which produces copper foil, the titanium ring was produced on the rolling machine. So the research on rolling of titanium ring is helpful to control and improve the quality of titanium ring, and then improve the quality of deposited copper foil.In this paper the thermal-mechanical physical simulation combined with numerical simulation method was adopted, and the rolling process of titanium ring used in deposited copper foil was analyzed. The thermo plasticity, hot deformation resistance and dynamic recrystallization of commercial pure titanium TA1 was researched by Gleeble-1500 D thermal simulation test machine under the temperatures of 800℃, 850℃,900℃, 950℃, 1000℃, 1050℃ and the strain rates were 0.01s-1, 0.1s-1, 1s-1. And the research provide basis for the determination of parameters in titanium ring rolling process. The rolling process was simulated by finite element software Deform-3D. The influence of different rotation speed of driving roll, feed rate of pressure roll, rolling temperature, friction factor of driving roll and axial roll on the ring rolling process was analyzed.Through the analysis of stress-strain curves and microstructure picture of optical electron microscope and scanning electron microscope. The results show that the deformation resistance of commercial pure titanium TA1 was characterized by dynamic recovery and dynamic recrystallization. Below the phase transformation point, the dynamic recrystallization occured during hot tensile. And the critical strain of dynamic recrystallization decreased with the increase of temperature and increased with the increase of strain rate, and the critical strain c? and the peak strain p? satisfy the relation of 0.478 c p? ??.Above the phase transformation point, dynamic recovery occured during hot tensile. The yield strength and the tensile strength of commercial pure titanium TA1 decrease with the temperature increase. The temperature and strain rate had a great influence of the damage value. The commercial pure titanium TA1 tend to be ductile fracture under the temperature of 800~850℃. With the temperature increase, at the temperature of 900~1050℃ the commercial pure titanium TA1 tended to be quasi-cleavage fracture.According to the conclusion achieved by thermal simulation test, a reasonable rolling temperature range was determined. The numerical simulation of titanium ring rolling was performed by Deform-3D. The simulation results shows that, the titanium ring can be produced with better quality under the conditions of lower rotation speed of driving roll v=1.75rad/s, variable feed rate of pressure roll 0.3-0.5-0.3mm/s, lower rolling temperature 850 ℃ and bigger friction factor 0.7. And then the process parameters were applied to actual production and got a better result.Through the study on titanium ring rolling process used in deposed copper foil, the results has guiding significance of actual production. And the quality of titanium ring was improved.
Keywords/Search Tags:Deposition of copper foil, commercial pure titanium TA1, model of deformation resistance, dynamic recrystallization, microstructure, numerical simulation
PDF Full Text Request
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