Of Co <sub> 2 </ Sub> Gas Shielded Welding Wire Chemical Copper Plating Process Analysis And Research

In the paper, the effects of the main compositions CuSO₄.5H₂O. H₂SO₄and FeSO₄.7H₂O on the surface of the welding wire with atmosphere ofcarbon dioxide are studied firstly and fundamental prescription of platingCopper is found. Then on the base of the former experiment, the effect ofthe rear-earth element additive CeCl on the quality of Copper layer on thesurface of welding wire and the technology of electronless-plating Copper isstudied. The best content of rear-earth element additive CeCl has been found.Finally the thesis studies the different effects of inhabiting and chromatingof plating Copper layer and Copper-Nickel electronless-plating layerreplacing Copper electronless-plating layer. The best prescriptions and thetechnologies of the three different treatments have been found.