The Anodic Bonding Of Glass-ceramic

Anodic bonding technology of semiconductor silicon and glass wafer is key technology of MEMS. As one of the key materials, there is a broad industrial applied future about anodic bonding glass. Pyrex glass and SD-2 glass are used to anodic bonding material which are encapsulated with silicon wafer, but they not only have slow velocity of etch, but also have high room temperature resistivity which need high temperature and high voltage when they are used to encapsulate, so contribute to toughen up encapsulated technology.In this thesis, glass-ceramics is used to anodic bonding with silicon, the glass-ceramics belong to Li20-Al203-Si02 silicon system. Based on the choice of basic constituents, proper alkali metals oxide and nucleation agent, the basic glasses have been prepared by adopting conventional melt quenching technology, and the temperature of nucleation and crystallization are determined by using DTA. The relation of glass constituents and DTA curve was investigated; At the same time, the glass samples were treated by adopting various heat-treatment methods. The relation between constituents, structure and properties of glass-ceramics was researched using of X-ray, SEM, IR and various measurements of physical and chemical properties. A kind of new glass-ceramic material with excellent anodic bonding was prepared. The result shows that, the glass-ceramics is transparent, higher strength and rigidity, lower room temperature resistivity and its thermal expansion coefficient close upon that of silicon, so it be able to used as MEMS' anodic bonding material.