Using Microscopic Moir¨¦ To Interferometry Sic/ti-15-3 Interface Residual Stress Field

Because of a significant mismatch between the coefficients of thermal expansion ofthe fiber of SiC and the matrix of Ti , the interfacial thermal residual stress in SiC/Ti-15-3composites is induced during the course of cooling procedure when continuous SiC fiberreinforced titanium-based composites are made .These residual stresses play an importantrole in the mechanics properties of composites.This paper aims to determine interfacial thermal residual stress. The study has beenperformed by means of micro-moiréinterferometry after pushing out a part of the fibers ofSiC. The high sensitive moiréfringes have been obtained in very fine resolution and highquality. The interfacial thermal residual stress fields can been calculated from moiréinterference pattern. At the same time, it has also been numerically simulated using the finiteelement software ---MSC.MARC.The results of the theoretical analysis, the experimental test and the finite elementsimulation have been discussed. It can be considered to be the relative comprehensiveanalyses of interfacial thermal residual stress in SiC/Ti-15-3 composites.