| Particle reinforced Cu-matrix composites are widely used in such flied as electronic industry, aviation, spaceflight et al. In order to improve the mechanical property and keep electrical conductivity of pure copper, in this paper, SiCp/Cu and Mo/Cu composites were prepared by mechanical alloying and sintering technology. By optical microscope (OM), scanning electron microscopy(SEM), tension test, The effects of the processing parameters were investigated on the structure, physical and mechanical properties of composites. The main results were as follows:(1) With the contents of SiC increased, the relative density and relative conductivity of the received SiCp/Cu composites gradually decreased, but hardness and tensile strength increased , while the anneal temperature increased, the tensile strength and hardness decreased but the relative conductivity increased. The optimized relative conductivity of as-received SiCp/Cu composites was equal to 49% or so, which could not meet the requires of the application.(2) The optimized parameters for the preparation of Mo powders were 150 r/min, 30h and 40h for milling in the dry and wet states respectively after the process control agent, stearin, was added.(3) With the contents of Mo increased the tensile strength and hardness of Mo/Cu composites increased at the initial stage and then decreased, and the relative conductivity of it vice verse. In addition, the relative conductivity of as-received Mo powder by dry milling was larger than that by wet milling.(4) The optimized performance, 90.2% for the relative conductivity, 501.1MPa for the tensile strength, and 144.9 HV hardness, could be gotten with the addition content of Mo powder equaled to 5%. These results were superior to that of some Cu alloys such as CA-151, FETEC-3S, EFTEC-6, KFC, KLF—2et al.(5) The physical and mathematical models for calculating the relative conductivity of Mo/Cu composites were given, and the relative error of it was less than 5%. |
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