For Electronic Packaging Composite 4j50/cu Wire Preparation Process And Organizational Performance

In this thesis, a new technique was introduced to prepare electronic packaging 4J50/Cu Compound wire. This Compound wire was made from skin of constant expansion coefficient alloy (4J50) and core of oxygen-free copper. Hot extrusion compound, cold working and diffusion annealing prepared this Compound wire. The compound interface was bonded together firmly and the solution solid alloy was generated at the compound interface region during diffusion annealing. The properties of compound wire, such as the density, young's modulus, specific resistance and the linear expansion factor, were measured. The mean axial linear expansion factorα_20-400℃ reached to 10.4-11.6×10^-6/℃.The specific resistance of Compound wire with external diameter of 1.6mm and internal core diameter of 0.6mm was 0.095O mm²/m.The leakage rate at the compound interface was less than 1×10^-8 Pa.L/s. The experiment value of compound wire fracture strength was almost identical to calculation result by compound principle. The research about diffusion on interface in compound wire showed that diffusion distant and time was accord with "parabola rule" in the diffusion theory. The 4J50 alloy and copper was metallurgical bonded firmly by interface diffusion. The diffusion of interface was influenced by process of hot extrusion and heat treatment.From this thesis, it was showed that the properties of interface, such as sealing-in, bond strength and leak tightness, were satisfied. The technique was steady and firm, and fit for large-scale production.