Study Of Low Temperature Plasma Technology In Surface Modification Of Polymer Materials

By enough electrons impact on the neutral gas atoms / molecules, these neutral gas will be decomposed to low-temperature plasma phenomenon. There are many methods to bring the low-temperature plasma. The methods in common use are directly discharge,radio-frequency discharge and micro-wave discharge etc.The mechanism of modification to the properties of the material surface by low-temperature plasma can chiefly consider as : within the reaction chamber of low-temperature plasma, under the accelerating of the electric field, by employing the low-pressure , electrons collisions with electrons and derive ions or atoms, generating the low-temperature plasma.To the manufacturing of the plating through-holes of the PTFE high frequency multilayer printed circuit board, the biggest difficulty is the activation pretreatment before the electro-less copper. Before the application of the technology of low-temperature plasma, in the field of the manufacturing of printed circuit board, mainly depending on chemical treatment solution, Besides, plasma technology can deliver higher uniformity and reproducibility than chemical processes. Compare with the sodium etch chemical process, it is efficient, economical and environmentally benign.Thesis study on the technology of the plasma treatment, instead of the chemical solution to the polymer material surface modification treatment, such as the PTFE,PI etc. Through manufacturing domestic first low-temperature plasma treatment machine, the collectivity design and particular of the low-temperature plasma treatment machine have been detailed introduced. At last, through studying on the surface modification mechanism of low-temperature plasma to polymer material, manufacturing the plasma treatment machine and studying on the process of the micro-wave printed circuit board, prepared the process criterion of the low-temperature plasma to the manufacturing of the micro-wave printed circuit board.