Font Size: a A A

Low Temperature Of Ag-cu-in-sn Solder Preparation Technology

Posted on:2009-01-29Degree:MasterType:Thesis
Country:ChinaCandidate:H ZhangFull Text:PDF
GTID:2191360278969091Subject:Materials science
Abstract/Summary:PDF Full Text Request
According to contemporary the short of silver-based solder whose melting points is between 500-600℃, the thesis analyzes the Ag-Cu-In-Sn series binary and ternary composition phase and the alloy content of Ag-Cu eutectic solder whose melting temperature is between 500-600℃is established. Using the method of hot and cold rolling after forcible big deformation hot extrusion and rapid solidification prepared the solder of the Ag-Cu-In-Sn alloys. The melting property, microstructure and phase composition of alloys were analyzed by DTA, X-ray, metalloscope and SEM. The flowability , wettability and mechanical property were tested and analyzed. The results show that:(1) The melting point of alloy with antivaccum casting treatment and vacuum casting treatment are confirmed through DTA analysis when Ag: Cu: In: Sn is 57.6: 22.4: 10: 10 , the melting point of alloy with vacuum casting treatment is 567℃, while the melting point of alloy with antivaccum casting treatment is 606℃. X-ray diffraction analysis show that the alloy are composed of Ag rich a phase with fcc structure and Cu richβphase with complex structure. There are lots of oxide phase such as SnO2,In2O3,CuO in alloy with antivaccum casting treatment.(2)The solder of Ag-Cu-In-Sn series can process to foil strip which below 0.1mm used the method of forcible big deformation hot extrusion process and rapid solidification. And the solder can be used in brazing the silver-based solders.(3)The surface quality of solder prepared by the two method after spread out on Ni plate is well on the temperature above liquid phase point 20℃,40℃and 60℃. Solder can melting well above the liquid phase point 20℃and the wetting property between solder alloy and Ni plate is very good. Meanwhile, above liquid phase point 60℃, solder can fully spread out and have good liquidity.(4)Compared with extrusion blooming technology the alloy which produced by the method of rapid solidification are composed of Ag rich phase and Sn11Cu39 phase. The composition of the alloy relatively simple without obvious oxidation so the processability is well, the alloy is more easy to made to finished product and is beneficial to batch production.
Keywords/Search Tags:Ag-Cu-In-Sn alloy, solder, extrusion, rapid solidification, wetting properties
PDF Full Text Request
Related items