Synthesis And Application Of Printed Circuit Boards In Acid Copper Plating Leveler

This paper was conducted on the acidic copper brightener (YL-603) which was applied for the processing of printed circuit board. The YL-603 was separated via atmospheric distillation, extract separation and chemical precipitation. The components of YL-603 were characterized and identified by IR, ~1H-NMR, and X-ray diffraction. The results are shown as follows: the sample of YL-603 contained water used as solvent, and 18.8 % for percentage mass content of the other contents; The percentage mass content of Polyethylene glycol(PEG) is 9.8 %; Sulfuric acid is also in existence and the pH of YL-603 is 0.98.Under the free radical initiator of a,a'-azobisisobutyroniytile, poly(N-vinyl-N'-butylimidazoliniumbromize)(QPVIBr), poly(N-vinyl-N'-butylimidazoliniumchloride)(QPVICI), poly(N-vinyl-N'-vinylimidazoliniumiodide)(QPVII), poly(N-vinyl-N'-benzylimidazoliniumchloride)(QPVIBCI), poly(N-vinyl-N'-epoxypropylimidazoliniumchloride)(QPVIECI), poly(N-vinylimidazole-co-ethylacrylate)(VI-EA) andpoly(N-vinyl-N'-butylimidazoliniumbromize-co-ethylacrylate)(QVI-EA) were synthesized from N-vinylimidazole, halogenide and ethylacrylate(EA). The structures of products were characterized by IR, ~1H-NMR, UV, EA, etc.The synthesized compounds were filtrated as acidic copper leveler according to the cathodic polarization curves. The results indicated that both QPVIBr and QVI-EA can promote the copper ion into polarization in PCB acidic copper plating bath greatly. Moreover, it was found that both of them have obvious chemical reaction impedance on copper eletrodeposition by the detection of impedance spectroscopy. Finally, the QPVIBr and QVI-EA were chosen as acidic copper leveler.The merits of QPVIBr and QVI-EA were discovered and presented in the electroplating experiments. When these two reagents were added in acidic copper plating bath, the brightening, leveling and fine coatings can be obtained. Moreover, better coverage ability of the plating bath than before was also found. The acidic copper plating bath added with QPVIBr can obtain more uniform coatings than YL-603. In the end, the optimal contents of additives in acidic copper bath constitutes were optimized as follows: PEG(6000)2.24 g/L, SPS 26 mg/L, AESS 0.02 g/L, QPVIBr 1.0-1.8 mL/L or QVI-EA 1.2-2.2 mL/L。...