Avionics New Structure And Function Module Thermal Design Optimization And Realization

Avionics system architecture is becoming more and more complex, Integration degree is becoming more and more high. Modularization and Integration are two important design principles of advanced avionics system, modularization is the physical basis of the necessary integration. So the project of Integrated Manufacturing Technology of Multifunctional Structure is researched to solve problems and develop high performance module.The development of future avionics equipments and modules is to the integrated, modular, small, intelligent, multi-function, high reliability, easy maintenance and scalability direction. These will inevitably lead to many problems such as thermal, electromagnetic compatibility and interface connection. At the same time, the functions of electronic equipment, size, weight, reliability, and adaptability to various environments is included in the structural design. These present higher demand to structural designer.With the improvement of integrated circuit and the increased heat flux, temperature has become the main factor that affects the reliability of electronic equipment. So solving the problem of heat dissipation is the main thought to design the module in this paper and the project of Integrated Manufacturing Technology of Multifunctional Structure is researched to solve problems. The preliminary work is described in this paper, including the selection of standard modules, thermal design concept and process, the module structure of design ideas, liquid cooling cold plate, locking devices, insertion-extraction device and shielding board.To optimize the design of pre-module structure, comparative analysis module processing options for resolving the multifunctional module manufacturing and cold plate welding problem, Integrated Manufacturing Technology of Multifunctional Structure is researched. The thermal testing system program of structure and function module was established in this paper, Pressure testing,flow testing,thermal testing was done, the treatment of thermal testing results and formulas have been proposed, comparative analysis the differences of the thermal test results and simulation results,the basic of thermal designing optimization was provided.By the testing data, from thermal layout optimization of power device, optimization of diversion column groups, optimization of thermal resistance three perspectives on the multifunctional modules for liquid cooling cold plate thermal design optimization. The multifunctional modules and aluminum plate model was the basis of thermal layout optimization of power device, comparative analysis of the power devices with different layout of the device temperature and the thermal cooling performance cold plate, were optimized for the layout of the project's power devices structure, and summarizes the flow for S-type power device layout method; The thermal testing results was the basis of diversion column groups optimization, Cold plate flow channel in the diversion column group concept and optimization of being introduced. The thermal simulation optimization of diversion column groups was to balance the thermal performance of cold plate and the pressure drop of fluid; The Purpose of optimization of thermal resistance was to Improve the efficiency of heat conduction, comparative analysis of the thermal resistance status of each model structure, the heat conduction of the power device path optimization to improve the efficiency of heat transfer, An efficient heat transfer scheme is proposed.The integrated manufacturing approach of the multifunctional modules, comparative analysis of thermal testing, thermal resistance model analysis, and thermal design optimization methods and ideas can be used for military and civilian equipment design in this paper, and has an important reference for structure design of electronic equipments. And it has a great strategic significance for national defense.