Through-hole Structure Modeling Of Multi-layer Microwave Circuits And Electromagnetic Characteristics

Continuous advances being made in circuit density and speed, at all the chip level, pack-age level and board level, are placing increasing demands on the simulation techniques on interconnects and discontinuity. But the pure numerical methods or commercial software suffer from large memory requirement and relatively slow simulation speed, can't keep up with the increase of the complexity of the problems.In this thesis, the typical through-hole via in multilayered microwave circuit is investigated. Decomposing it into interior and exterior structure, modeling and analyzing them accurately and respectively, a general and fast approach is presented for calculating the electromagnetic character of the through-hole via in layered media and metal.To the exterior structure, through expanding and dispersing its surface, we get the meshes of the structure of exterior through-hole via, and describe them in node matrix and grid matrix. Using the method of moments (MoM) with RWG basis function, Calerkin's testing and the face space Green's functions, the current on the exterior structure is obtained; using the matrix pencil method, the modes in the current are extracted; and the parameter of exterior structure can be gotten. The average CPU times per frequency for calculating the parameter of exterior structure is less than 10 second. To the interior structure, we use the physical-based model including parallel plane effects. The model based on planar circuits for microwave, introduce the parallel planes impedance (Zpp) to describe the interaction between the via transitions and the reference planes in terms of cavity modes, and use the via barrel-to-plane capacitance to approximate the fringing fields in the near region around via. The models have been validated against full-wave simulation and measurement up to 40 GHz.The exterior and interior structures are combined to obtain the S-parameters of the trace and through-hole via after their network parameters being solved separately. To validate the accuracy, reliability and frequency of the solution, extensive comparison with Ansoft's HFSS versions 12 and measurement for different layered vias are presented. And the numerical results are included to investigate the frequency dependent propagation characteristics for via structures with various geometrical parameters.At the last chapter of this thesis, a via simulation software developed by the author and his partner is presented. Architecture and module of the software are introduced simply, and the test conclusion of the software is shown detailedly in this chapter.