| Polyimide film materials are a very promising and high-performance polymer. It has the combination properties of marked thermal-stability, mechanical, electrical, radiation-resistance and corrosion-resisted. Because of these combination properties, it widely used in the field of aviation, microelectronics and communication. However, the applied scale of polyimide film materials can be influenced by the property of hard-processing which it caused by the characteristics of insoluble and infusible. In these years, the thermoplastic of polyimide (TPI) is extremely being paid more attention for the easily-processing and widely used scale.Combining the m-TB, TPE-Q and TPE-R as the chemical materials, in this thesis, it takes the BPDA as the dianhydride and uses the synthesis method to obtain the polyimide film materials finally. Besides of this, it takes the comparative analysis using the polyimide film made on the forward experiments.This thesis takes infrared spectrum to test the structure of polyimide film materials. On the basis of TG tests, it can be concluded that the beginning and ending temperature of some kind of films is between 400℃and 500℃. When it was heated to 600℃, the quality residue is still keep in 75% to 85%. By means of DSC, it can be showed that the glass trasitio temperature of these films is from 230℃to 300℃. By the methods of mechanical property test, the tensile strength and elongation at break of these films is between 86MPa and 296MPa and from 2% to 53% respectively. Finally, by the means of the solvent resistance test, it can be obtained some kind of films which it shows excellent in the characteristics of acid resistance, alkali resistance and organic solvent resistance. |
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