Ultrsonic Vibration Assisted Grinding Of Tungstem Carbide Micro-Cylindrical Array

Tungsten carbide is hard, light, stable for thermal, appropriate to work underpressure and has elastic modulus. As a micro-structure material, it has a uniqueadvantage in improving the surface integrity and structural retention for tiny structuresin the field of micro-cylindrical grinding array and it has been widely used.Micro-cylindrical array is concave grinded one by one parallel by forming circularwheel and it has intersection between each other, so it is a typical micro-structure.Ultrasonic vibration assisted grinding is a new ultra-precision machining technologycombined by grinding and ultrasonic machining technology. It has high-precision fromgrinding and high-efficiency from ultrasonic machining technology, and it creats a newsituation of grinding.This paper is based on previous studies, and it used the full range of jointlaboratory grinding equipment from Harbin Institute of Technology-Machine Co., Ltd.Hangzhou ultra precision grinding technology, for a cylindrical array of tungstencarbide micro-process of ultrasonic vibration grinding research. The article worked onthe experiment study mainly from the following aspects:(1) Grinding parameters have great influence on the quality of grinding, so theexperiment was planed to find the best grinding parameters for the integrity ofmicro-cylindrical array. By orthogonal analysis, we researched on wheel size, wheelspeed, feed rate, grinding depth and grinding angle for the influence of the surfaceroughness, surface accuracy and grinding force. The grinding wheel wear after longhours of work, so we detected the changes of surface quality to study the life of thewheel.(2) We designed and set up the ultrasonic vibration assisted grinding system tostudy the influence of the ultrasonic vibration on surface roughness, surface accuracyand grinding force for different grinding parameters. By the dynamometer, the laserscanning confocal microscope, the surface profiler, the scanning electron microscopeand the other devices, we detected the process of grinding and checked the grindingsurface quality, to quantify the influence of ultrasonic vibration assisted grinding onthe processing mechanismand, the advantages and disadvantages.(3) We used the conclusions of experiments and the best grinding parametersabove, to work on the cylindrical array of tungsten carbide micro ultrasonic assistedgrinding.