Micro-Tensile Testing Of Copper Microwires And Scale Effect Research

With the knowledge of human nature-level expansion,micro-scale view of thecognitive and applied research has become a major issue in the new century. MaterialsScience and Engineering requirements of materials, more solid, lighter, more tough andmore versatility, as represented by information technology to MEMS devices andmicroelectronics development of optoelectronic devices, nano science and technology,both on the micro-and nano-scale material properties and structure of the scale effect studyand propose urgent needs and requirements.Concept of micro-scale study by the scale and other restrictions, interdisciplinaryresearch is relatively more difficult. Concept of micro-scale experiments by the equipment,sample preparation, and other related factors of the more restrictions, is extremely difficult,and less relevant trials. This topic details the laboratory developed fiber tensile testingmachine, tensile testing machine and fiber-based Analysis and Testing Center test platform,combined with micron copper fiber preparation process, the application of SEM and othermicroscopic analysis, the appearance of copper fiber morphology, size, etc. to be assessed,EBSD analysis of copper, fiber processing technology during the preparation of the grainevolution, EBSD technique proposed application of the macro-mechanical properties offiber forecasting methods; system testing of copper fiber tensile properties and found thatthe performance of the scale effect on the trend; Corrosion damaged fiber surface andremoving layers fiber micro-tensile test found that as the diameter decreases, the yieldstrength and enhanced with a more substantial rate increase. Take the comparison, whenthe diameter is less than about35μm, the yield stress in vain increased30%, showing astrong scale effect. Application of SEM observation shows that the diameter of its finergrain size, grain size is smaller; shows that the scale effect results when the fine grainstrengthening; and made cold-drawn copper, fiber density of dislocation dynamics modelof dynamic recrystallization.